Flip chip mining
if it is not a hard disk, but a CD / U disk, then enter the BIOS settings and set the computer to boot from the hard disk.
1. Clothes: clothes should be loose, breathable and comfortable. Because in the month inside to a large number of sweating, so to keep the skin clean
2. Living: the air is relatively circulating and the temperature is appropriate, so the room temperature should be adjusted at 24 ℃ - 26 ℃. In winter, it should be appropriately higher. In summer, air conditioning can still be used, but the temperature is controlled between 24 ℃ and 26 ℃
3. OK: it's not like lying in bed for 30 days, you can go out on the 31st day. In fact, postpartum for pregnant women, in order to postpartum uterus so big a wound to stop blood, so pregnant women is a kind of hypercoagulable state, easy to form thrombosis. Postpartum, especially after cesarean section, is more likely to form thrombosis. So postpartum normal vaginal delivery should be early activities, cesarean section surgery should encourage anesthetics disappear, after 24 hours as early as possible out of bed activities, to prevent thrombosis. After normal natural labor, 2-3 days later, you can do proper bed exercises, such as abdominal muscle, back muscle, hip muscle and anal sphincter muscle training. To caesarean section, it is after 1 week, 10 days commonly, also can do this kind of health care exercise on the bed appropriately to help the body recover. After 42 days postpartum, in the past of puerperium, we should do aerobic exercise, walk, jog, graally increase, 15 minutes a day graally increase to 45 minutes a day, or do yoga, postpartum lactation is on the one hand, exercise is on the other hand, these two are two important links to rece postpartum obesity
4. Food: Chinese people may eat more animal protein when they eat soup ring confinement. And vegetables and fruits, eat less. In fact, ring confinement, nutrition should be the same as that in late pregnancy, and should not be reced. I don't feel like I don't need to eat these things after I have a baby. The baby gets nutrition through the placenta in the uterus. After the baby is born, it needs to get nutrition through the milk. Therefore, ring the lactation process, the calcium and iron eaten in the late pregnancy should continue to be eaten. In addition, in fact, the emphasis on food variety, but not excessive, to be balanced, with coarse and fine grains, vegetables and fruits are to eat, a day to ensure that a jin of vegetables, half should have green, dark green vegetables, or red, yellow vegetables to supplement vitamins, minerals and trace elements. In terms of animal protein, fish, poultry, eggs, milk and lean meat, which are high-quality animal protein and plant protein, are bean procts. They should be increased by two liang every day in the non pregnant state, so as to meet the needs of milk proction. In addition, the recovery of the whole body also needs these high-quality animal protein, but in this process, we should give up smoking and drinking, and do not advocate drinking strong tea and strong coffee, because these will affect the absorption of iron, and the baby will also be affected after eating the mother's milk.
flip chip pad is on one side of the substrate, which saves the process of wire bonding, but increases the accuracy requirements of solid crystal, which is not concive to improve the yield. The front is all light-emitting surface, no pad shading, light efficiency has been greatly improved.
Real estate name: Fengjing garden, Xincheng, Nanjing City: Nanjing location: No.19, Xinle Road, Dachang street, Liuhe City developer: Nanjing Fengnan Investment Co., Ltd.
property right period: 70 years
building type: multi-storey, slab building,
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Planning Information: it covers an area of 15927 square meters, with a plot ratio and greening rate of 30%. It has 0 buildings, 286 parking spaces and 80 yuan above ground parking spaces. Monthly, 150 yuan underground parking spaces
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internal support: Safety Management: doorman registration
Health Service: garbage fee, health fee
(the information is for reference only, and the final information is subject to the information of the sales office.)
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The term "flip chip technology" includes many different methods. Each method has many differences, and the application is also different. For example, as far as the selection of circuit board or substrate type is concerned, whether it is organic material, ceramic material or flexible material, it determines the selection of assembly materials (bump type, flux, underfill material, etc.) and, to a certain extent, the selection of required equipment. In the current situation, each company must decide which technology to adopt, which type of process parts to purchase, which research and development to meet the needs of future procts, and how to minimize the capital investment and operating costs
in SMT environment, the most common and appropriate method is solder paste flip chip assembly process. Even so, in order to ensure manufacturability, reliability and achieve cost targets, many changes in the technology should be taken into account. At present, the widely used flip chip method is mainly based on the interconnection structure. For example, gold-plated conctive polymer or polymer / elastomer bumps are used to achieve compliant bump technology. Solder ball bonding (mainly gold wire) or electroplating technology should be used to realize the bump technology, and then conctive isotropic adhesive should be used to complete the assembly. The bonding point of IC (1c) should not be affected in the process. In this case, we need to use anisotropic conctive film. Solder bumps include evaporation, electroplating, electroless plating, stencil printing and spray. Therefore, the choice of interconnection determines the bonding technology needed. In general, alternative bonding technologies include reflow bonding, thermoultrasonic bonding, hot pressing bonding and transient liquid bonding
the above technologies have both advantages and disadvantages, and are usually driven by applications. However, as far as the standard SMT process is concerned, the solder paste flip chip assembly process is the most common and has been proved to be completely suitable for SMT. The traditional solder paste flip chip assembly process includes flux coating, chip cloth, solder paste reflow and underfill. However, in order to ensure the successful and reliable flip chip assembly, we must pay attention to other matters. Often, success begins with design
the primary design consideration includes solder bumps and bottom bumps to minimize the stress on the interconnects and IC bonding points. If the interconnection design is appropriate, the known reliability model can predict the problems that will occur in the solder paste. This can be achieved by reasonable design of IC bonding point structure, passivation, polyimide opening and UBM structure. The design of passivation opening must achieve the following goals: rece the current density; Rece the area of concentrated stress; Improve the life of electromigration; The cross-sectional area of UBM and solder bumps is maximized
bump location layout is another design consideration. Solder bumps should be symmetrical as far as possible, with the exception of identifying directional features (removing a corner bump). The layout design must also consider that the downstream slicing operation will not be disturbed. The placement of solder bumps on the active region of an IC also depends on the electrical performance and sensitivity of the IC circuit. In addition, there are other IC design considerations, but wafer bumps manufacturing companies have special IC solder joint and layout design criteria to ensure the reliability of bumps, so as to ensure the reliability of interconnection
the main board design considerations include the size of the metal solder joint and the associated solder mask opening. First of all, the wetted area of the plate solder joint must be maximized to form a strong bonding point. However, it must be noted that the wetting area on the plate should match the diameter of UBM. This is helpful to form a symmetrical interconnection and avoid the problem of stress imbalance, that is, the stress at one end of the interconnection is higher than that at the other end. In fact, the design usually adopts the method that the solder joint diameter of the board is slightly larger than the UBM diameter, in order to concentrate the bonding stress on one end of the circuit board instead of the weak IC. The wetting area of solder joint can be controlled by proper design of solder mask opening
both solder mask design and no solder mask design can be used, but the combination of the two methods is the most reliable design method. The proper solder joint position can be designed by using rectangular openings on the related PCB graphics and taking the clarity of solder mask into account. If the design is not reasonable, once the assembly environment changes or the mechanical factor changes, the IC will appear solder fatigue fracture. The bottom packing method can greatly improve the reliability of flip chip components interconnection, but if the design criteria are not strictly followed, the same failure mechanism will inevitably occur. Solder bumps act as mechanical, electrical and sometimes thermal interconnects between IC and PCB. In a typical flip chip device, the interconnection consists of UBM and solder bumps. UBM is lapped on the wafer passivation layer to protect the circuit from external environment. In fact, UBM acts as the base of the bump. It has excellent adhesion with wafer metal and passivation material, acts as a diffusion layer between solder paste and IC bonding metal, and provides an oxidation barrier wetting surface for solder paste. UBM stack plays an important role in recing the stress under IC solder joint
as mentioned above, there are many kinds of solder bump manufacturing technologies. The evaporation method requires sputtering barrier metal (mask or photolithography) on the wafer surface to form UMB, and then evaporating Sn and Pb to form solder. In the subsequent process, Sn and Pb solder are reflowed to form spherical bumps. This technology is very suitable for bumps with high lead content (relative to solder bumps) using high temperature resistant ceramic substrates. However, for SMT applications on organic circuit boards, high lead solder bumps on IC need fusible solder to form interconnects
low cost bump manufacturing technologies, such as electroplating or stencil printing (combined with sputtering or electroless plating UBM), are commonly used at present. These processes cost less to make bumps than evaporation, and using fusible solder on the circuit can save the process and cost of placing it on the circuit board. Other solder alloys currently proced include lead-free solder, high lead solder and low lead solder α Solder, etc
for the electroplating bump process, the UBM material is sputtered on the surface of the whole wafer, then photoresist is deposited, and an opening is formed on the IC bonding point by photolithography. The solder material is then plated onto the wafer and included in the opening of the photoresist. Then, the photoresist is peeled off and the exposed UBM material is etched to reflow the wafer to form the final bump. Another common method is to print the solder template on the patterned UBM (sputtering or electroplating) and then flow it
it is very important to control the final height of the bump. It can ensure a high assembly yield. Destructive bump cut-off testing methods used to monitor bump fabrication processes often lead to failure modes in solder paste, but never to UBM or underlying IC solder joints
wafer cutting is often seen as the first step in back-end assembly. The abrasive diamond blade was sliced at 60000 rpm. Deionized water should be used in cutting to improve the quality of cutting and prolong the life of blade. At present, it is an urgent task to rece chip defects on a single IC. Because the chip on the top may be close to the active region of the chip, the chip on the back is extremely detrimental to the reliability of the flip chip. The edge fracture, even the back chip in the chip area, often expands under the action of thermal stress and mechanical stress, leading to the early failure of the device. After cutting the chip, the single chip can be left on the chip or placed in the waffle packaging container, gel container, Surftape or belt and shaft package. Flip chip placement devices must have the ability to handle chips with bumps. Waffle container is suitable for small batch or test free chip; Belt and shaft are suitable for SMT mounting equipment; Chips sent to placement devices are common and most suitable for mass manufacturing applications
the actual flip chip assembly process starts with the distribution of flux. There are many ways to distribute flux, including immersion, extrusion, stencil printing, or spray. Each method has its advantages and application scope. Soldering flux or adhesive wetted components are usually installed on the mounting equipment. This method has the advantage of fixing the flux to the chip bumps
it is necessary to control the height of the flux film and the rotation speed of the disk for the repeatability of mass proction. The flux distribution process must accurately control the flux distribution quantity and repeatability. Template printing flux is suitable for mass proction, but it has higher requirements for countercurrent equipment. No matter which method is used, the characteristics of the material and the compatibility of the flux must be considered when pasting flip chip devices
after the flux distribution process is completed, the chip can be picked up by multi head high-speed component pickup system or ultra-high precision pickup system. In order to promote the combination of semiconctor back-end manufacturing and EMS assembly market
Beijing, September 22 (Xinhua) Li Huanying (female) Sun Maofang, researcher of Tropical Medicine Research Institute of Beijing Friendship Hospital, Zhao Guoqiang, former deputy political commissar of General Hospital of Beijing Military Region, driver of Beijing Yinjian taxi company, a careless builder in Beijing, Zhao Zhiliang, leader of construction team of Anhui Fuyang jia'an Construction Service Co., Ltd., Pu Cunxin, chairman and Secretary of general Party branch of Beijing Caishikou Department Store Co., Ltd., vice president of Beijing People's Art Theater Che Yahua, vice chairman of China Drama Association (female), Yang Liying, resident of Weijia community, Jingshan street, Dongcheng District, Beijing (female), Zhang Junlan, resident of huiwanhong community, Changying District, Chaoyang District, Beijing (female), editor of Tianjin daily Reporter Wei Hong, an Yanjiang, an employee of Tianjin steel pipe company, Chen Yonggang, a villager of Jiujie village, wangqingtuo Town, Wuqing District, Tianjin city (Hui nationality), Li Weilian, a master of Computer Science in school of information technology, Nankai University, Li Huizhong, chief physician of Oncology Department of Tianjin people's Hospital, Li Huizhong, chairman of Tianjin guifaxiang Mahua catering group Co., Ltd Wang Baoquan, Secretary of the Party committee, Zhao Jinghua, deputy leader of Tianjin sports team and head coach of Tianjin Women's volleyball team (female), Bao Shoukun, resident of Heping Road community, Xiaozhan Town, Jinnan District, Tianjin, Bai Baohai and Zheng Bingqiang, train inspectors of the depot of the Ministry of transport of Hebei Chengde Iron and Steel Group Co., Ltd., Bai Baohai are taxi drivers in Huanghua City, Hebei Province; Zheng Bingqiang is the procuratorial staff of Huanghua people's Procuratorate of Hebei Province, Gu Yuepan, the self-employed person of Xinhua Trade Center in Shijiazhuang City, Hebei Province, Shi Cuiping (female), teacher of School of life sciences of Hebei Agricultural University, sun Yanrong, director of family planning service station of Qinghe County, Hebei Province, Zhao Deping, President of Dachang Pingju song and dance troupe performance Co., Ltd., Dachang Hui Autonomous County, Hebei Province, ban Yin Cao Jiang, employee of Hebei Handan xiang Food Co., Ltd. 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(female), Li Shengxiang, retired cadre of former No.2 Light Instry Bureau of Zezhou County, Jincheng City, Shanxi Province, Hu bingshen, chairman of Wufeng hotel of Wutai Mountain Scenic Area, Xinzhou City, Shanxi Province, retired from Xiaxian Township Enterprise Administration Bureau of Yuncheng City, Shanxi Province Retired cadre Zhao Yuefang, postal delivery clerk Zhao Quanxiang, Huguan County post office, Chang City, Shanxi Province, cleaning group leader of environmental health management office in Yangquan City, Shanxi Province, Lian Aixin (female), family member of Yunxia Construction Engineering Co., Ltd. of Shanxi Coking Coal Huozhou Coal Power Group, Zhang Lianyun (female), President of "loving mothers" association of Hohhot City, Inner Mongolia, Chen Yunguang, Inner Mongolia Autonomous Region Su Rina, deputy secretary of the Party committee, Secretary of the Discipline Inspection Commission and chairman of the National People's Congress of Shibao Town, Damao Banner, Baotou City (female, Chai Xingen (Manchu) physical ecation teacher of Longshan middle school, Jinshan Town, karaqin banner, Chifeng City, Inner Mongolia Autonomous Region Wang Chunyu, Party Secretary of the Fourth Engineering Co., Ltd. of China Railway Construction 19th Bureau Ern (Mongolian) president of the No.253 Hospital of the Inner Mongolia Military Region of the Chinese people's Liberation Army Dewey Inner Mongolia Agricultural University Student Gao Yuxian (female), general manager of Xinte drugstore in Diaobingshan City, Liaoning Province Wang Dong, deputy leader of No.4 squadron of vehicle management team of ciyutuo oil proction plant of Liaohe Oilfield Company of PetroChina Tang binggui, villager Wang Xiuzhen (female), DAGUJIAZI village, Huangjia Xibo Township, Shenbei New District, Shenyang City, Liaoning Province, milkman Cui Ji of Shenyang Huishan Dairy Co., Ltd Just sun Jianshe, leader of "Party member vanguard team" of Liaoning Benxi Jitai Taxi Co., Ltd., Wenchang community policeman Chang Guiqin (female) of Shiqiaozi police station of Linghe Branch of Jinzhou Public Security Bureau, Liaoning Province, Zhang Baoyan (female) of Jianchang village, Manchu Township of Jianchang City, Xingcheng City, Liaoning Province, President of "Baobao home" Volunteer Association of Tonghua City, Jilin Province, xiubao Jilin Baomin lawyer's Office Director Jiang Zhibao (name with black box) was Wang Wenwen, a villager of nilihe village, Baoquanshan Town, Chang Korean Autonomous County, Jilin Province. President of Meihekou agricultural economic and Technological Association, Xu jinku, manager of sports lottery betting station No. 05710, Jiaohe City, Jilin Province. President of Baicheng social psychiatric hospital, Jilin Province Du Shun, Secretary of the general Party branch, teacher of Wanfu village primary school, Daxing Town, Changling County, Songyuan City, Jilin Province, Liu Chunling (female), resident of the 13th Bureau community, Changchun Automobile Instry Development Zone, Jilin Province, Chen Lirong (female), villager of Xinsheng village, Daxing Town, Dongfeng County, Jilin Province, Li Xiuqin (female), public toilet administrator of Sanli market, Shuangyashan City, Heilongjiang Province, Chen Yanmei (female), Qiqihar City, Heilongjiang Province Yang Hui, director of health center of Chengxi village, Keshan Town, Keshan County, Du Jingren, security guard of Harbin securities business department of China national securities, Zhong Manjun, villager of Fuqiang village, Huayuan Town, Lindian County, Daqing City, Heilongjiang Province, Yu Xuemei, villager of Xingfu village, Xingfu Township, Shuangcheng City, Heilongjiang Province Ren Wangying, director of Songfengshan police station of Acheng branch of Harbin Public Security Bureau, Gao Yanju, resident of Xinxing street, Yangming District, Mudanjiang City, Heilongjiang Province, Cheng Xiuling (female), Archivist of material supply department of Qitaihe branch of Heilongjiang Longmei group, Bai Wanqing (female), President of Jing'an Temple Street elderly association, Jing'an District, Shanghai, Zha Wenhong (female), Shanghai Wuning department store Xiang quanxiong, a retired employee, is a resident of Ruijin 2nd Road, Luwan District, Shanghai Peng Weiyuan, self-employed entrepreneur, captain of Shanghai Yuhai Shipping Co., Ltd., Yang Zhaoshun, Secretary of the general Party branch of Shanghai Taopu town Wisteria Garden neighborhood committee, Wang Jun, senior technician of Baoshan Iron and Steel Co., Ltd., Zhang Hao (name with black box) was vice captain of the fifth branch of criminal Investigation Corps of Shanghai Public Security Bureau, Wu Youping (female), retired worker of Shanghai Hongkou District Civil Defense Office, Hong Yuemin Shanghai Huangpu District Huangpu District Street neighborhood residents Chen Yanping (female) Jiangsu Taizhou Jingjiang City People's court vice president Xu Zhaohua Jiangsu Yangzhou Yangzhou Municipal Public Security Bureau Weiyang branch deputy political commissar Yang Xuetao Jiangsu province Nanjing city Jin Shenghong Passenger Transport Co., Ltd. taxi driver Geng Gao Peng (name plus black box) was born in Changzhou Institute of Mechatronic Technology Province student Wei Wei Qing (female) worker of Environmental Sanitation Department of Yancheng City Management Bureau, Jiangsu Province, Lu Licai, chief staff member of Changzhou detention center, Jiangsu Province, Zhang Nengping (female) villager yuan Meifen of Shanbei village, MABA Town, Xuyi county, Huai'an City, Jiangsu Province, Yan Yina (female), manager of Bubugao clothing city, Huashi Town, Jiangyin City, Wuxi City, Jiangsu Province Zhang Yu, a villager of Xiaojin village, Daoxu Town, Shangyu City, Shaoxing Province, was born in gexizhang village, Xizhou Town, Xiangshan County, Ningbo City, Zhejiang Province Huazhong Agricultural University Student Ma Chunfeng, chairman of Zhejiang Wanhao Food Co., Ltd. Yu Jiayou, Zhejiang Daily reporter Zhong Xingju (female), resident doctor of Bixia community health service center, Shengshan Town, Shengsi County, Zhoushan City, Zhejiang Province Yan genmei (female), villager Cao Qiufang, Yangguang village, Lincheng Town, Changxing County, Huzhou City, Zhejiang Province (female), student Liu Lei, Dongguan middle school, Shangyu City, Zhejiang Province, Anhui Province Cao Jun (name with black box) and Lu Shuai (name with black box) in banshe village, Maojianshan Township, Yuexi County were the deputy director of Shiqiao forest police station of Ningguo Forest Public Security Bureau, Anhui Province; Lu Shuai was a sophomore of Anhui Institute of foreign economics, Fang Haiying, manager of state power project Department of maintenance branch of Anhui Tongling Wanneng Tongling Power Generation Company, he Zhicheng, villager Ren Ying of Yashan village, Hewan Town, Nanling County, Anhui Province, female, principal of hope primary school, Chengguan Town, Linquan County, Anhui Province, Liu Qiong, female, villager Zeng Demei of taoyuanhe village, zhufo'an Town, Huoshan County, Anhui Province, Fujian Province Zhang zhuangyin, vice president of Youxian Association of regular student aid activities Chen maoxun, employee of Fujian Experimental Kindergarten Wang Yongcheng, villager of Dongjiao Village, Xiaolian Island, Dalian Township, Pingtan County, Fujian Province Lin Shuiying (female), chairman of Fujian Blind Association Li Bin, chairman of Hualin vegetable base Co., Ltd., Putian City, Fujian province Zhan Hongli (female), deputy procurator of anti corruption Bureau of Fujian Provincial People's Procuratorate, Fujian Province Fan Yingjiao (female), President of juvenile court of Yanping District People's Court of Nanping City, Fujian Province, Jiang Guozhen, villager of hantou village, Nanyang Town, Shouning County, Fujian Province, Zhan xueyin, retired teacher of Luofang middle school, Xinyu City, Jiangxi Province, Ou Yangqi, director of Taiyang village, Duchang County, Jiangxi Province, executive general manager of Pengfei Jiantao Co., Ltd., Jingdezhen City, Jiangxi Province, Zheng Yidong, retired cadre of Xuri street, Shangrao County, Jiangxi Province Yimei (name with black box) was Chen Yongqi, Secretary of the Party branch of Zhuangxi village, Hongtang Town, Yuanzhou District, Yichun City, Jiangxi Province. Min Qingmei, deputy political commissar of Qingshanhu Public Security Bureau, Nanchang City, Jiangxi Province (female), Chen Yongzhong, temporary worker of environmental sanitation office of Jing'an County, Jiangxi Province. Zhang Yugui, retired worker of Zhelin post office, Yongxiu County, Jiangxi Province. Chen Jinliang, resident of Shuangyue community, Dongcheng Street, Mudan District, Heze City, Shandong Province Zhu Shouying, retired policeman of Dong'e County Public Security Bureau, Liaocheng City, Shandong Province, Zhang Guangcheng, resident of mingerju, Mingshui street, Zhangqiu City, Shandong Province, Wang Qinfeng, villager of huobazhang village, economic development zone, Qihe County, Shandong Province, leader of spark group of Shandong Haomai Machinery Technology Co., Ltd., sun Jianbo, researcher of Zibo Forestry Bureau, Shandong Province Liu Mingjun (female), Secretary of the Party committee of Yuanshan forest farm, Zibo City; Meng Fanai (female), member of the Local Taxation Bureau of Laizhou City, Shandong Province; Mai Shirui (female, Hui nationality), villager of Wangzhuang village, Shuiguo Town, Shizhong District, Zaozhuang City, Shandong Province General manager Huang Jiusheng Secretary of the Party branch of migrant workers in shuangliushu Town, Huangchuan County, Henan Province Huang Wei manager of Lutong Instrial Company of Henan Road and Bridge Construction Group Li Jiangfu project manager of Henan new City Construction Co., Ltd. Cheng WuChao chairman of internal combustion engine intake and exhaust pipe Co., Ltd. of Xixia County, Henan province Shen zhandong (name with black box) was a member of Zhengzhou public security bureau Du Mingxiang, a policeman of the fourth special police brigade of the patrol detachment, Yang Changlin, a villager of Caowang village, Zhaocun Township, Luyi County, Henan Province, Wang Tianxi, a retired teacher of Wuhan University, Wang pan (name with black box) and his son Wang Tianxi are villagers of guiyunshan village, Bailianhe Township, Luotian County, Hubei Province; Wang pan was a villager of guiyunshan village, Bailianhe Township, Luotian County, Hubei Province. He was Wang Tianxi's son Li Hao (name with black box) and Wu zonge (female). Li Hao was a bus driver of Nanzhang water mirror Transportation Co., Ltd. in Xiangyang City, Hubei Province; Wu Zong'e is an employee of urban passenger transport management office of Nanzhang County, Xiangyang City, Hubei Province, Li Guochu, a villager of yezhuchi village, Shuiyuesi Town, Xingshan County, Yichang City, Hubei Province, Jiang Zhiguo, director of skin disease prevention and Control Institute of Tuanfeng County, Hubei Province, Huang Guiying (female), a retired cadre of Hubei Vocational and technical college, Li Guowu, a resident of xiongjiatai community, Xima street, Jiang'an District, Wuhan City, Hubei Province Ltd. manager Zhu Guoqing (Tujia nationality) captain Chen Jianjiao (Tujia nationality) of Lishui cold water ferry, Cili County, Zhangjiajie City, Hunan Province vice chairman of the people's Congress of Xinguan Town, Shimen County, Hunan Province Zeng Yuping (female) village doctor of Xingxing village clinic, liuzhai Town, longhui County, Hunan province Shen Guochu, chief member of the second brigade of traffic police detachment of Changde Public Security Bureau, Hunan Province Pan Xiaohong (female, Vice principal of Nan Central Primary School, Lanshan County, Hunan Province
therefore, it is front mounted relative to flip chip<
flip chip: in order to avoid the influence of the light-emitting area occupied by the electrodes in the front chip on the light-emitting efficiency, the chip researchers designed the flip chip structure, that is, the front chip is inverted, so that the light excited by the light-emitting layer is directly emitted from the other side of the electrode (the substrate is finally stripped, and the chip material is transparent). At the same time, the structure for flip chip is designed to facilitate the soldering line of LED packaging factory, Therefore, the whole chip is called flip chip, which is widely used in high-power chips
electrode: it is divided into positive electrode and negative electrode
polarity: refers to whether the electrode is positive or negative, which is a description of the electrode
people often ask: what is the polarity of the electrode
hope to answer your questions.