Hyb digital cryptocurrency
Publish: 2021-05-21 09:17:15
1. Hyb: refers to qimengda video memory
18: voltage, a decimal point in the middle is OK, 18 is 1.8V, 25 is 2.5V
t: video memory type, D: DDR T: DDR2 H: DDR3
256: single video memory capacity: the number is how much, converted to MB needs to be divided by 8, for example, 512Mbit = 64M
256Mbit = 32m
16: single video memory bit width: the number is how much, Generally, there are 32 and 16bit
5A: Code of improved version
F: package type, F: FBGA (RoHS) e: TSOP (RoHS)
25: video storage speed, and the middle fantasy is a decimal point. For example, 10 is 1.0ns, 14 is 1.4ns, and XP (1.4ns-1.2ns) is a special one. The purchase price is 1.4ns, which is cheaper
18: voltage, a decimal point in the middle is OK, 18 is 1.8V, 25 is 2.5V
t: video memory type, D: DDR T: DDR2 H: DDR3
256: single video memory capacity: the number is how much, converted to MB needs to be divided by 8, for example, 512Mbit = 64M
256Mbit = 32m
16: single video memory bit width: the number is how much, Generally, there are 32 and 16bit
5A: Code of improved version
F: package type, F: FBGA (RoHS) e: TSOP (RoHS)
25: video storage speed, and the middle fantasy is a decimal point. For example, 10 is 1.0ns, 14 is 1.4ns, and XP (1.4ns-1.2ns) is a special one. The purchase price is 1.4ns, which is cheaper
2. Hanyi round stack body simple, just under, personal test
3. First of all, your memory uses Siemens Infineon memory particles
0742, which means it was proced in the 42nd week of 2007
this part is composed of eight parts, which convey the same information as Samsung and Hyundai, including capacity, bit width, working voltage and so on. The meaning of each part is explained one by one according to the following table
all Infineon memories have "hyb" in part 1, because these three letters represent that the memory particles are made by Infineon
Part 2 represents the working voltage and consists of two digits“ 39 "represents 3.3V," 25 "represents 5V," 18 "represents 1.8V
Part 3 represents the memory type and consists of one letter“ S "means that the memory is SDRAM," d "means that the memory is DDR," t "means DDR2
Part 4 represents capacity and consists of three digits. "128", "256", "512" and "1g" represent 128MB, 256MB, 512MB and 1GB capacity respectively
Part 5 represents the phase width of a single particle and consists of two numbers“ 40 "stands for 4bit," 80 "stands for 8bit," 16 "stands for 16bit.
Part 6 stands for proct registration," 0 "stands for standard proct
Part 7 represents the proct version number and is composed of one letter. Like Hyundai and Samsung, the lower the alphabet, the newer the memory version
Part 8 represents the package type and consists of one letter“ C "denotes FBGA (leaded) package“ T "denotes TSOP 400mil (leaded) package; E represents TOSP 400 mil (lead-free and halogen-free) package; G stands for stacked TSOP (lead-free halogen-free) package.
0742, which means it was proced in the 42nd week of 2007
this part is composed of eight parts, which convey the same information as Samsung and Hyundai, including capacity, bit width, working voltage and so on. The meaning of each part is explained one by one according to the following table
all Infineon memories have "hyb" in part 1, because these three letters represent that the memory particles are made by Infineon
Part 2 represents the working voltage and consists of two digits“ 39 "represents 3.3V," 25 "represents 5V," 18 "represents 1.8V
Part 3 represents the memory type and consists of one letter“ S "means that the memory is SDRAM," d "means that the memory is DDR," t "means DDR2
Part 4 represents capacity and consists of three digits. "128", "256", "512" and "1g" represent 128MB, 256MB, 512MB and 1GB capacity respectively
Part 5 represents the phase width of a single particle and consists of two numbers“ 40 "stands for 4bit," 80 "stands for 8bit," 16 "stands for 16bit.
Part 6 stands for proct registration," 0 "stands for standard proct
Part 7 represents the proct version number and is composed of one letter. Like Hyundai and Samsung, the lower the alphabet, the newer the memory version
Part 8 represents the package type and consists of one letter“ C "denotes FBGA (leaded) package“ T "denotes TSOP 400mil (leaded) package; E represents TOSP 400 mil (lead-free and halogen-free) package; G stands for stacked TSOP (lead-free halogen-free) package.
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