How to get to Jiading Guojin Sports Center in Shanghai South
Publish: 2021-05-16 09:56:16
1. Take line 3 at Shanghai South subway station, transfer to line 9 at Yishan Road station and get off at Songjiang sports center station. It takes about 1 hour and 15 minutes to get there. The ticket price is 7 yuan.
2. Starting from the passenger transport center station, there are No.4 or No.11 buses to the bus terminus and the north of the bus terminus, and No.42 buses to the north of the bus terminus
ticket price: 1 yuan for Route 4, 2 yuan for route 11 and route 42
number of stations: 11 (16 stations), 4 (17 stations), 42 (26 stations).
ticket price: 1 yuan for Route 4, 2 yuan for route 11 and route 42
number of stations: 11 (16 stations), 4 (17 stations), 42 (26 stations).
3.
4. Flip chip is not only a kind of chip interconnection technology, but also an ideal chip bonding technology. As early as 30 years ago, IBM has developed and used this technology. But until recent years, flip chip has become a popular packaging form in the field of high-end devices and high-density packaging. Today, flip chip packaging technology is widely used, and the packaging forms are more diversified, so the requirements of flip chip packaging technology are also increasing. At the same time, flip chip also presents a series of new challenges to manufacturers, providing reliable support for packaging, assembly and testing of this complex technology. In the past, the active area of the chip is facing up, back to the substrate and post bonding, such as wire bonding and tape automatic completion (TAB). In FC, the active area of the chip is faced to the substrate, and the interconnection between the chip and the substrate is realized by the solder bumps arranged in array on the chip. The silicon wafer is directly installed on the PCB in the form of flip-flop, and the I / O is led out from the silicon wafer. The interconnection length is greatly shortened, the RC delay is reced, and the electrical performance is effectively improved, This kind of chip interconnection can provide higher I / O density. The occupied area of flip chip is almost the same as the chip size. In all surface mount technologies, flip chip can achieve the smallest and thinnest package
fc-bga (flip chip ball grid array) is a relatively new packaging form supporting mounting plate. It adopts C4 controllable collapse chip method to weld, which greatly improves the electrical performance and is said to improve the packaging yield (no specific data is found). This kind of package allows direct connection to the bottom layer. Specifically, it is composed of silicon cores inverted on the bottom of the component. Metal balls are used to connect the processor instead of the original pins. If welding is compared to sewing, this kind of welding method can make the pins uniform, the connection distance is shorter, and the pin spacing is increased, thus avoiding the phenomenon of false welding and pin bending. A total of 479 balls with a diameter of only 0.78mm are used in fc-bga package, which greatly reces the package height. How about the "pin" is really small enough? The advantages of this process are also obvious: it can greatly rece the size of the chip after packaging (the core / package ratio can be 1:1.5), expose the core, and increase the heat transfer efficiency. There is no doubt that this process is very suitable for high-speed chip packaging. In addition, because the pin of the chip is led out from the center direction, the distance between the chip and the substrate is shortened, so the interference is less, the electrical signal transmission is faster, stable and pure, which is very helpful for overclocking. At present, Taiwan's major packaging plants, such as quanmao, riyueguang, jingshuo and South Asia, have the ability to do fc-bga packaging. Of course, in terms of cost, fc-bga is much more expensive than wirebond package (2.5 US dollars vs 1 US dollars)! The following are the theoretical frequency values of the two packages:
wirbond fc-bga
theoretical limit frequency * 400MHz 580mhz
* the frequency is closely related to the number of transistors / power consumption, etc.
we can see that the theoretical limit of fc-bga package is about 1.45 times that of wirbond
the price of the ordinary fx5600xt core is 47 US dollars, while the price of the fc-bga packaged Vpu is nearly 20 US dollars, and the ratio of shipping volume is 100:1, which is very rare
flip chip, also known as flip chip, is to deposit tin shot on the I / O pad, and then flip the chip. By combining the molten tin shot with the ceramic machine board, this technology will replace the conventional wire bonding and graally become the mainstream of packaging in the future. At present, it is mainly used in high clock CPU, GPU (graphic processor unit) and chipset procts. Compared with cob, the chip structure and I / O end (solder ball) direction of this packaging form are downward. Because I / O leads are distributed on the whole chip surface, flip chip has reached the peak in packaging density and processing speed, especially it can be processed by means similar to SMT technology, which is the final direction of chip packaging technology and high-density installation
there are three main types of flip chip connection: C4 (controlled collapse chip connection), DCA (direct chip attachment) and FCAA (flip chip adhesive attachment)
C4 is a form similar to ultra-fine spacing BGA. Generally, the spacing of solder ball array connected with silicon wafer is 0.23 mm and 0.254 mm. The diameter of solder ball is 0.102 mm and 0.127 mm. The composition of solder ball is 97pb / 3Sn. The solder balls can be completely or partially distributed on the silicon wafer
because ceramics can withstand high reflow temperature, ceramics are used as the substrate of C4 connection. Usually, Au or Sn plated connection disks are pre distributed on the surface of ceramics, and then connected by C4 flip chip. The advantages of C4 connection are as follows:
1) excellent electrical and thermal properties
2) high I / O number in the case of medium ball spacing
4) suitable for mass proction
5) greatly reced size and weight
DCA and C4 are similar to ultra-fine spacing connection. The structure of DCA wafer is the same as that of C4 wafer. The only difference between them is the choice of substrate. The substrate used in DCA is a typical printed material. The ball composition of DCA is 97pb / Sn, and the solder on the bonding pad is eutectic solder (37Pb / 63Sn). For DCA, it is very difficult for eutectic solder with spacing of only 0.203 mm and 0.254 mm to be left on the bonding pad, so it is necessary to replace the solder paste to plate lead tin solder on the top of the bonding pad before assembly. The solder volume on the bonding pad is very strict, which is usually more than that of other ultra-fine spacing components. The solder with the thickness of 0.051 mm and 0.102mm on the bonding pad is pre plated, which is generally slightly dome shaped. It must be leveled before mounting, otherwise it will affect the reliable alignment of the solder ball and pad
FCAA connection has many forms and is still in the initial development stage. Solder is not used in the connection between silicon wafer and substrate, but glue is used instead. In this connection, there can be solder balls or solder bumps at the bottom of the wafer. The adhesives used in FCAA include isotropic and anisotropic adhesives, which mainly depend on the connection conditions in practical applications. In addition, the selection of substrates usually includes ceramics, printed board materials and flexible circuit boards. Flip chip technology is one of the most advanced microelectronic packaging technologies. With the further rection of the volume of electronic procts in the 21st century, flip chip will be more and more widely used
flip chip packaging technology has many obvious advantages over traditional wire bonding technology, including superior electrical and thermal properties, high I / O pin count, and reced package size
flip chip packaging technology is superior to conventional wire bonding technology in thermal performance. Nowadays, many electronic devices; ASIC, microprocessor, SOC and other packages dissipate 10-25w or more power. However, the dissipation power of BGA devices with enhanced heat dissipation wire bonding is only 5-10W. According to the working conditions, heat dissipation requirements (maximum junction temperature), ambient temperature and air flow, package parameters (such as using external heat sink, package and size, number of substrate layers, number of ball pins), flip chip package can generate 25W dissipation power
the excellent thermal performance of flip chip package is determined by the low thermal resistance heat sink and structure. The heat generated by the chip is dissipated by the heat sink inside and outside the heat sink. The heat sink is in close contact with the chip surface to obtain low junction temperature θ jc In order to rece the thermal resistance between the heat sink and the chip, a high thermal conctivity colloid is used between them. The heat in the package is more easily dissipated. To further improve the heat dissipation performance, the external heat sink can be directly installed on the heat sink to obtain low junction temperature θ jc
another important advantage of flip chip package is its electrical performance. Wire bonding technology has become the bottleneck of high frequency and some applications. Flip chip packaging technology is used to improve the electrical performance. Nowadays, many electronic devices work in high frequency, so signal integrity is an important factor. In the past, 2-3ghz was the upper frequency limit of IC package, flip chip package could be as high as 10-40ghz according to the substrate technology used.
fc-bga (flip chip ball grid array) is a relatively new packaging form supporting mounting plate. It adopts C4 controllable collapse chip method to weld, which greatly improves the electrical performance and is said to improve the packaging yield (no specific data is found). This kind of package allows direct connection to the bottom layer. Specifically, it is composed of silicon cores inverted on the bottom of the component. Metal balls are used to connect the processor instead of the original pins. If welding is compared to sewing, this kind of welding method can make the pins uniform, the connection distance is shorter, and the pin spacing is increased, thus avoiding the phenomenon of false welding and pin bending. A total of 479 balls with a diameter of only 0.78mm are used in fc-bga package, which greatly reces the package height. How about the "pin" is really small enough? The advantages of this process are also obvious: it can greatly rece the size of the chip after packaging (the core / package ratio can be 1:1.5), expose the core, and increase the heat transfer efficiency. There is no doubt that this process is very suitable for high-speed chip packaging. In addition, because the pin of the chip is led out from the center direction, the distance between the chip and the substrate is shortened, so the interference is less, the electrical signal transmission is faster, stable and pure, which is very helpful for overclocking. At present, Taiwan's major packaging plants, such as quanmao, riyueguang, jingshuo and South Asia, have the ability to do fc-bga packaging. Of course, in terms of cost, fc-bga is much more expensive than wirebond package (2.5 US dollars vs 1 US dollars)! The following are the theoretical frequency values of the two packages:
wirbond fc-bga
theoretical limit frequency * 400MHz 580mhz
* the frequency is closely related to the number of transistors / power consumption, etc.
we can see that the theoretical limit of fc-bga package is about 1.45 times that of wirbond
the price of the ordinary fx5600xt core is 47 US dollars, while the price of the fc-bga packaged Vpu is nearly 20 US dollars, and the ratio of shipping volume is 100:1, which is very rare
flip chip, also known as flip chip, is to deposit tin shot on the I / O pad, and then flip the chip. By combining the molten tin shot with the ceramic machine board, this technology will replace the conventional wire bonding and graally become the mainstream of packaging in the future. At present, it is mainly used in high clock CPU, GPU (graphic processor unit) and chipset procts. Compared with cob, the chip structure and I / O end (solder ball) direction of this packaging form are downward. Because I / O leads are distributed on the whole chip surface, flip chip has reached the peak in packaging density and processing speed, especially it can be processed by means similar to SMT technology, which is the final direction of chip packaging technology and high-density installation
there are three main types of flip chip connection: C4 (controlled collapse chip connection), DCA (direct chip attachment) and FCAA (flip chip adhesive attachment)
C4 is a form similar to ultra-fine spacing BGA. Generally, the spacing of solder ball array connected with silicon wafer is 0.23 mm and 0.254 mm. The diameter of solder ball is 0.102 mm and 0.127 mm. The composition of solder ball is 97pb / 3Sn. The solder balls can be completely or partially distributed on the silicon wafer
because ceramics can withstand high reflow temperature, ceramics are used as the substrate of C4 connection. Usually, Au or Sn plated connection disks are pre distributed on the surface of ceramics, and then connected by C4 flip chip. The advantages of C4 connection are as follows:
1) excellent electrical and thermal properties
2) high I / O number in the case of medium ball spacing
4) suitable for mass proction
5) greatly reced size and weight
DCA and C4 are similar to ultra-fine spacing connection. The structure of DCA wafer is the same as that of C4 wafer. The only difference between them is the choice of substrate. The substrate used in DCA is a typical printed material. The ball composition of DCA is 97pb / Sn, and the solder on the bonding pad is eutectic solder (37Pb / 63Sn). For DCA, it is very difficult for eutectic solder with spacing of only 0.203 mm and 0.254 mm to be left on the bonding pad, so it is necessary to replace the solder paste to plate lead tin solder on the top of the bonding pad before assembly. The solder volume on the bonding pad is very strict, which is usually more than that of other ultra-fine spacing components. The solder with the thickness of 0.051 mm and 0.102mm on the bonding pad is pre plated, which is generally slightly dome shaped. It must be leveled before mounting, otherwise it will affect the reliable alignment of the solder ball and pad
FCAA connection has many forms and is still in the initial development stage. Solder is not used in the connection between silicon wafer and substrate, but glue is used instead. In this connection, there can be solder balls or solder bumps at the bottom of the wafer. The adhesives used in FCAA include isotropic and anisotropic adhesives, which mainly depend on the connection conditions in practical applications. In addition, the selection of substrates usually includes ceramics, printed board materials and flexible circuit boards. Flip chip technology is one of the most advanced microelectronic packaging technologies. With the further rection of the volume of electronic procts in the 21st century, flip chip will be more and more widely used
flip chip packaging technology has many obvious advantages over traditional wire bonding technology, including superior electrical and thermal properties, high I / O pin count, and reced package size
flip chip packaging technology is superior to conventional wire bonding technology in thermal performance. Nowadays, many electronic devices; ASIC, microprocessor, SOC and other packages dissipate 10-25w or more power. However, the dissipation power of BGA devices with enhanced heat dissipation wire bonding is only 5-10W. According to the working conditions, heat dissipation requirements (maximum junction temperature), ambient temperature and air flow, package parameters (such as using external heat sink, package and size, number of substrate layers, number of ball pins), flip chip package can generate 25W dissipation power
the excellent thermal performance of flip chip package is determined by the low thermal resistance heat sink and structure. The heat generated by the chip is dissipated by the heat sink inside and outside the heat sink. The heat sink is in close contact with the chip surface to obtain low junction temperature θ jc In order to rece the thermal resistance between the heat sink and the chip, a high thermal conctivity colloid is used between them. The heat in the package is more easily dissipated. To further improve the heat dissipation performance, the external heat sink can be directly installed on the heat sink to obtain low junction temperature θ jc
another important advantage of flip chip package is its electrical performance. Wire bonding technology has become the bottleneck of high frequency and some applications. Flip chip packaging technology is used to improve the electrical performance. Nowadays, many electronic devices work in high frequency, so signal integrity is an important factor. In the past, 2-3ghz was the upper frequency limit of IC package, flip chip package could be as high as 10-40ghz according to the substrate technology used.
5. Consider Hansi new materials, whose flip chip underfill is always used by our company, which is much better than other brands we used before.
6. A chip flip chip welding technology is characterized in that the welding is realized on one side of the plug-in, the metal structure and the solder ball are welded along the end layer metal plate with lead as the matrix, and the solder ball is welded on the silicon wafer.
7. Flip chip LED has obvious advantages. It doesn't need to lay gold wire, saves a process, and won't proce a series of problems e to wiring. The proct is more stable, and the chips can be placed densely. For the same size, flip chip can put more chips, realizing the characteristics of small size and large streamer concentration. In addition, flip chip is directly laid on the substrate, and the thermal resistance is also reced a lot, But the price of flip chip will be more expensive than that of formal one, so it is only necessary to use flip chip for specific procts. If you are interested, you are welcome to discuss.
8. Thousand needle stone forest to tanalis to 240, and then to the next crater to 300 or higher
in the end, the most painful process begins, all kinds of flying, all kinds of pain.. This time is too painful.. Here I have no good way, shadow Moon Valley seems to mine more.. If you rush above 350, you will be free
mining a little cobalt in the Arctic.. You can gallop on the mainland, and you can go down to pick until you can pick sarong
gallop to Dongyong lake, and you will know why sarong evil iron is so cheap.. Normal 515 leave Dongyong lake..
in the end, the most painful process begins, all kinds of flying, all kinds of pain.. This time is too painful.. Here I have no good way, shadow Moon Valley seems to mine more.. If you rush above 350, you will be free
mining a little cobalt in the Arctic.. You can gallop on the mainland, and you can go down to pick until you can pick sarong
gallop to Dongyong lake, and you will know why sarong evil iron is so cheap.. Normal 515 leave Dongyong lake..
9. These two models can't be compared equally
gtx1060 3G or 6G is better than rx470
of course, rx470 has a good cost performance! The price is much lower than that of gtx1060 ~ ~
1080p resolution, rx470 and gtx1060 are all available for all major mainstream games, and the performance is good!!
gtx1060 3G or 6G is better than rx470
of course, rx470 has a good cost performance! The price is much lower than that of gtx1060 ~ ~
1080p resolution, rx470 and gtx1060 are all available for all major mainstream games, and the performance is good!!
10. Route 1: No.144 tourist line 6A
get on from No.144 (Shanghai South Station), take 7 stops to (Tianyaoqiao Road station, Zhongshan South 2nd Road), walk for about 3 minutes to the transfer point
transfer to tourist line 6A (Shanghai Gymnasium station), take 10 stops to (huilongtan station)
get on from the starting point, walk for about 3 minutes, and then walk for about 5 minutes and 30 seconds to the destination, The driving distance is 38.9 km
bus time
1.144; Ticket selling mode (no ticket selling); Ticket price (2 yuan); Time (to Shanghai South Railway Station: 6:00-22:45, to Nanpu Bridge: 5:20-23:00); Departure interval (5 minutes); Transfer discount (yes); Type (urban bus); Vehicle type (large bus); Vehicle condition (air conditioned vehicle); Driving condition (general); Auto company (Shenxin bus); Telephone number of the team (3424, 1999)
2; Ticketing method (conctor); Ticket price (2-10 yuan); Time (to Jiading: 06:30-17:20; To Shanghai Gymnasium: 07:05-19:05); Departure interval (about 15-30 minutes); Transfer discount (none); Type (special line); Vehicle type (large bus); Vehicle condition (good); Driving conditions (congestion); Automobile Company (bus shares); Telephone number of the team (64265990)
line 2 Shanghai Tangshan special line of Metro Line 3
get on from Metro Line 3 (Shanghai South Station), take 11 stops to (Zhongtan Road Station), walk for about 3 minutes and 30 seconds to the transfer point
get on from Shanghai Tangshan special line (Jiaotong road Yichuan Road Station), take 18 stops to (Tacheng Road Station)
get on from the starting point, walk for about 2 minutes, then walk for about 7 minutes to the terminal point, It's 44.0 km by car
line 3, Shangjia line jiatanghua branch line
get on from Shangjia line (Shanghai South Station), take 11 stops to (Jiading passenger transport center station), walk about 1 minute to the transfer point
transfer to Jiatang line (Jiading passenger transport center station), take 1 stop to (Tacheng Road Station)
get on from the starting point, walk about 8 minutes, walk about 4 minutes and 30 seconds to the terminal, The distance is 39.5km
bus time
1. Jiatanghua branch of jiatanghua branch bus line
ticket price: 1-2 yuan; Interval: 40 minutes; Shanghai Dazhong Public Transport Co., Ltd; Tel: 59168011; Time (to liu sanatorium: 05:20-17:40; To Jiading passenger transport center: 06:00-18:20)
2; Ticketing method (conctor); Ticket price (air conditioning 2-11 yuan, ordinary 1-5 yuan); Time (to Shanghai South Railway Station: 06:00-20:00; To Jiading passenger transport center: 06:00-21:00); Departure interval (30 minutes); Transfer discount (yes); Type (suburban line); Vehicle type (large bus); Vehicle condition (air conditioned vehicle is relatively new; Ordinary car (old); Driving condition (general); Affiliated Automobile Company (Jiading public transport company); Telephone number of the team (59168011);
get on from No.144 (Shanghai South Station), take 7 stops to (Tianyaoqiao Road station, Zhongshan South 2nd Road), walk for about 3 minutes to the transfer point
transfer to tourist line 6A (Shanghai Gymnasium station), take 10 stops to (huilongtan station)
get on from the starting point, walk for about 3 minutes, and then walk for about 5 minutes and 30 seconds to the destination, The driving distance is 38.9 km
bus time
1.144; Ticket selling mode (no ticket selling); Ticket price (2 yuan); Time (to Shanghai South Railway Station: 6:00-22:45, to Nanpu Bridge: 5:20-23:00); Departure interval (5 minutes); Transfer discount (yes); Type (urban bus); Vehicle type (large bus); Vehicle condition (air conditioned vehicle); Driving condition (general); Auto company (Shenxin bus); Telephone number of the team (3424, 1999)
2; Ticketing method (conctor); Ticket price (2-10 yuan); Time (to Jiading: 06:30-17:20; To Shanghai Gymnasium: 07:05-19:05); Departure interval (about 15-30 minutes); Transfer discount (none); Type (special line); Vehicle type (large bus); Vehicle condition (good); Driving conditions (congestion); Automobile Company (bus shares); Telephone number of the team (64265990)
line 2 Shanghai Tangshan special line of Metro Line 3
get on from Metro Line 3 (Shanghai South Station), take 11 stops to (Zhongtan Road Station), walk for about 3 minutes and 30 seconds to the transfer point
get on from Shanghai Tangshan special line (Jiaotong road Yichuan Road Station), take 18 stops to (Tacheng Road Station)
get on from the starting point, walk for about 2 minutes, then walk for about 7 minutes to the terminal point, It's 44.0 km by car
line 3, Shangjia line jiatanghua branch line
get on from Shangjia line (Shanghai South Station), take 11 stops to (Jiading passenger transport center station), walk about 1 minute to the transfer point
transfer to Jiatang line (Jiading passenger transport center station), take 1 stop to (Tacheng Road Station)
get on from the starting point, walk about 8 minutes, walk about 4 minutes and 30 seconds to the terminal, The distance is 39.5km
bus time
1. Jiatanghua branch of jiatanghua branch bus line
ticket price: 1-2 yuan; Interval: 40 minutes; Shanghai Dazhong Public Transport Co., Ltd; Tel: 59168011; Time (to liu sanatorium: 05:20-17:40; To Jiading passenger transport center: 06:00-18:20)
2; Ticketing method (conctor); Ticket price (air conditioning 2-11 yuan, ordinary 1-5 yuan); Time (to Shanghai South Railway Station: 06:00-20:00; To Jiading passenger transport center: 06:00-21:00); Departure interval (30 minutes); Transfer discount (yes); Type (suburban line); Vehicle type (large bus); Vehicle condition (air conditioned vehicle is relatively new; Ordinary car (old); Driving condition (general); Affiliated Automobile Company (Jiading public transport company); Telephone number of the team (59168011);
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